Phone Mainboard Side-View Final AOI
A standard SMT final-inspection AOI for phone mainboards. Boards on carriers travel along a double-track conveyor; one top camera with 3D DLP and RGB + UV lighting, plus four side-view cameras, image each board from above and from the front, rear, left and right. Inspection items include underfill and encapsulation coverage, shield solder, CSP cosmetic defects, surface dents and solder pad contamination.
- Side-view camera resolution
- 2 um/pixel
- Top camera resolution
- 10 um/pixel
- 3D Z-direction precision
- 0.02 mm
Specifications
- Inspection type
- Underfill fillet at BGA / interposer, underfill coverage, underfill protrusion, encapsulation coverage, insufficient shield solder, CSP cosmetic defects (side-edge chipping / cracks), surface dents, solder pad contamination
- Inspection criteria
- Underfill fillet height > 25%; underfill protrusion < 0.25 mm; surface dent < 0.03 mm2
- Camera
- 1 top camera + 4 side-view cameras
- Side-view camera depth of field
- 1.7 mm
- Top camera depth of field
- 6 mm
- 3D DLP system resolution
- 1 um
- Light source
- RGB + UV lighting; 3D DLP ×4
- Inspection accuracy
- 2D (XY direction): ≥10 um; 3D (Z direction): ≥20 um
- Overkill rate
- < 5%
- Escape rate
- < 0.05%
- GRR (gauge repeatability and reproducibility)
- ≤ 10%
- Correlation
- R² > 0.8, slope: 0.9-1.1
- Footprint
- 1350 mm × 1550 mm × 1680 mm
- Mechanism
- Adjustable conveyor line, X movement module, Y movement module, inspection module
- Process
- Double-track loading, top camera + 3D DLP, top camera + RGB + UV, side cameras + RGB + UV, unloading
- Suitable products
- Phone mainboards
- Air pressure
- 0.6 KG/cm³
See it in action
Silent clips from our 3D machine animations. While a clip is playing, you can pause it from the corner button.
3D animation Dome light with structured-light projection over a circuit board; a side-view camera sits at the upper left. 
3D animation Double-track conveyor inside the machine: a carrier of mainboards is fed in and stops at the inspection position.
Highlights
Double-track conveyor for loading and unloading
3D imaging by the top camera with four 3D DLP units, used for surface-dent inspection
Top camera imaging under RGB + UV lighting
Four side-view cameras image the board from the front, rear, left and right under RGB + UV lighting
Modular structure: adjustable conveyor line, X and Y movement modules and an inspection module
Overkill rate < 5%, escape rate < 0.05%
Typical application
Final inspection of phone mainboards on SMT lines
Interested in this product?
Contact our engineering team for pricing and technical details.
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