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Semiconductor
Wafer, die, and substrate-level inspection and assembly with sub-micron repeatability.
Industry Overview
Wafer cutting blade inspection, sensor assembly, and motor-housing tap-and-drill systems handle the most demanding tolerances in the industry. Our integrated thermal and vibration compensation keeps measurements stable through full shifts.
Monocrystalline wafer cutting blade inspection
Micro-sensor assembly line
Motor housing drill / tap integration
Sub-micron metrology with thermal compensation
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