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Smart Assembly Equipment
Phone Mainboard Laser Cutting Machine
A laser cutting machine for phone mainboard panels. Panels are conveyed in on a carrier, positioned by camera and cut with a nanosecond laser, with an air-draft duct beside the cutting head.
Specifications
- Process
- Camera positioning, air draft, nanosecond laser cutting
- Laser
- Nanosecond laser
- Product thickness
- 0.5 mm
- Cycle time (CT)
- 6 s/pcs
- Cosmetic performance
- No particles visible to the naked eye (under CCD 50x)
- Suitable products
- Phone mainboards
- Air pressure
- 0.6 KG/cm³
See it in action
Silent clips from our 3D machine animations. While a clip is playing, you can pause it from the corner button.
3D animation Laser cutting close-up: the beam cuts one tab of the mainboard panel, switches off, then moves on to the next.
Highlights
Camera positioning before cutting
Air draft at the cutting head
Cutting with a nanosecond laser
Typical application
Laser cutting of phone mainboard panels
Interested in this product?
Contact our engineering team for pricing and technical details.
Talk to an engineer