Phone Board 2D Defect AOI
An intelligent vision inspection system developed by Dinnar for defect inspection of mobile phone components. Using vision imaging, it detects extra parts, foreign matter, insufficient solder, short circuits, excess glue, insufficient glue, glue offset and glue overflow.
- Repeat positioning accuracy (Z & Y axes)
- ±0.02 mm
- Inspection speed
- 6 s/pcs
- Max inspection size
- 50×100 mm
Specifications
- Inspection type
- Extra parts, foreign matter, insufficient solder, short circuits, excess glue, insufficient glue, glue offset, glue overflow
- GRR (gauge repeatability and reproducibility)
- ≤ 10%
- Suitable products
- Mobile phone components
- Inspection method
- Inline / offline
- Camera
- Industrial camera
- Inspection system
- VisionOne software platform
- Air pressure
- 0.6 KG/cm³
See it in action
Silent clips from our 3D machine animations. While a clip is playing, you can pause it from the corner button.
3D animation A mainboard flows in from the line, stops under the camera head for inspection, then flows back out.
Full film
Phone main-board machines: laser cutting, side-view final AOI and in-line AOI (3D animation)
3D-animated overview of three machines for phone main boards: a laser cutting machine that positions the panel by camera and cuts it with a laser, a side-view final AOI with a double-track conveyor, and an in-line AOI station that takes boards from the assembly line, inspects them and sends them back out. On-screen labels are in English.
Highlights
Inspects products for defects
Strong compatibility: covers multiple measurement items on the same product
Stable operation: 4k inspections per day without machine faults
Fast: dual channels, dual stations and dual measurement units, CT = 6 s/pcs
Typical application
Mobile phone component production lines
Interested in this product?
Contact our engineering team for pricing and technical details.
Talk to an engineer